Package Development Engineer Job in Hyderabad at Micron

Micron is hiring for the role of Package Development Engineer!

About the company:

Micron offers a rich portfolio of innovative memory solutions that are enabling advances across a wide range of markets and industries. From CXL memory, to high-speed GDDR6, to DDR5 and NVDIMMs, Micron memory products deliver fast data access speeds, reduce power consumption, and lower the space requirements.

Responsibilities of the Candidate:

• Responsible the package design integration activities by working with cross-functional team and partners for package technology development, including material development, process development, DOEs, and related activities.
• Work with a cross-functional team across several geographies to create package design databases such as package stack-up, wire-bond fanout, route-study, substrate layout, wire bond/Die placement diagrams, and other design documentation.
• Work with Substrate and PCB (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements in Design for manufacturing (DFM)/ Design for Assembly (DFA)
• Design complex package layout keeping in mind signal integrity, power integrity, thermal and mechanical requirements.
• Contributing to cross group communication to work towards standardization and group success.